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CERTeM + platform

Since 2014, CERTeM is involved in a new research topic : interconnexion and packaging of 3D components. CERTeM has developed a dedicated platform : CERTeM Plus, that includes two clean rooms and a laboratory.

The purpose of CERTeM Plus platform is to adapt to technological evolution of electronic chips in terms of miniaturization and integration and to develop new processes in the field of components packaging.

CERTeM Plus platform was built with financial support from Tours Metropole and FEDER and relies on STMicroelectronics Tours infrastructures.

Interconnection and dicing

  • Semi-automatic wedge bonding
  • Wire bonding
  • Die bonding
  • Automatic wedge bonding
  • Dicing machine

Electronic lithography

  • E-beam lithography

Advanced characterization

  • Platform of multi-channels tests on high frequency acoustics MEMS
  • Polarization and characterization platform of piezoelectric materials
  • Impedencemetry bench
  • Vibrometer laser UHF
  • Optical and acoustic characterization bench
  • Nanoscratch tester
  • Nanoindentation 
  • Confocal microscope
  • Digital holographic microscope
  • Scanning electron microscope